U. K RR, Manikantan S, Poojary L, V.R V, . S. An influence of substrate thickness on electrical conductivity of dip-soldered copper joints. jmmf [Internet]. 2022 Apr. 28 [cited 2024 May 19];69(12A):255-9. Available from: https://www.informaticsjournals.com/index.php/jmmf/article/view/30112