U. K, R. R.; MANIKANTAN, S.; POOJARY, L.; V.R, V.; ., S. An influence of substrate thickness on electrical conductivity of dip-soldered copper joints. Journal of Mines, Metals and Fuels, [S. l.], v. 69, n. 12A, p. 255–259, 2022. DOI: 10.18311/jmmf/2021/30112. Disponível em: https://www.informaticsjournals.com/index.php/jmmf/article/view/30112. Acesso em: 19 may. 2024.